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Abstract

This work examines the production and analysis of electrospun fibers made from pure and CuO-doped polyvinylpyrrolidone (PVA) polymers. These fibers are then applied to glass and p-type silicon wafers. The ideal parameters for electrospinning were a flow rate of 0.5 ml/h, a voltage of 15 kV, and a distance of 16 cm between the collector and the needle. X-ray diffraction investigation determined that the PVA fibers were amorphous, but the CuO-doped samples had a tetragonal phase. Fourier Transform Infrared Spectroscopy (FTIR) was employed to examine the vibrational properties, modes, and network bonding in the 400 to 4000 cm–1 spectral range. Scanning Electron Microscopy (SEM) analysis provided detailed analysis and yielded information on the structure, fibers’ thickness, and CuO distribution. The UV-Vis spectral study showed that the optical band gap reduced from 2.7 eV (pure PVA) to 2.4 eV (10 wt.% CuO) as the quantity of CuO increased. Assesses the electrical behavior of the fibers by analyzing their current-voltage (I-V) characteristics in illuminated and non-illuminated circumstances. This analysis yields essential information about the fibers’ response to light and their non-linear electrical properties, which are relevant for electronic and photovoltaic applications. The results emphasize the influence of CuO. The impact of doping on PVA fibers’ structural, optical, and electrical properties indicates their potential for use in various electronic applications. A comprehensive approach offers fresh perspectives on the diverse capabilities and prospects of many electronic applications, highlighting the substantial influence of CuO doping in augmenting these features. Overall, the findings underscore the potential of CuO-doped PVA fibers in advancing electronic and optoelectronic technologies.

Keywords

CuO, Fibers, Nanocomposites, Photosensor, PVA

Subject Area

Physics

Article Type

Article

First Page

3408

Last Page

3420

Creative Commons License

Creative Commons Attribution 4.0 International License
This work is licensed under a Creative Commons Attribution 4.0 International License.

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