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Abstract

This study aims to synthesize a new class of silicon polymers P1-P4 were synthesized based on dichlorodimethylsilane (DCDMS) with some organic compounds containing terminal hydroxyl groups were synthesized for the first time[M1-M4] via condensation polymerization .Also, their nanocomposites P′1-P′4 were prepared in the presence of 0.7% the silver nanoparticles (Ag-NPs) using the solution casting method. The structures of all monomers and polymers were characterized by FTIR and 1H-NMR spectroscopy, which allowed to identify functional groups of monomers and silicone polymers. Thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) test were performed to analyze thermal behavior and effect of the presence of silver nanoparticles. The results of thermal analysis showed that the presence of phenyl rings demonstrated the thermal stability of pure silicon polymers, and the introduction of silver nanoparticles of 7% weight showed an improvement in the thermal performance of nanocomposites P′1-P′4 compared to pure silicon polymers. Which means that the temperature for weight loss (TGA) was higher for the most nanocomposite P′1-P′4, where the TGA for polymers increased from 127 for polymer P2 to 196 for its nanocomposite P′2, this may be due to filling the free voids between the Polymerized chains by silver nanoparticles. The silver nanoparticles were characterized and analyzed using X-ray diffraction XRD and scanning electron microscopy. The X-ray study showed the presence of silver nanoparticles and the average size of nanoparticles ranged from 20 -30 nanometers. The surface study was performed using scanning electron microscopy which showed a fairly uniform shape for the silver nanocomposites.

Keywords

Dichlorodimethylsilane, Nanocomposite, Silicone polymer, Silver nanoparticles, Thermal analysis

Subject Area

Chemistry

Article Type

Article

First Page

1102

Last Page

1115

Creative Commons License

Creative Commons Attribution 4.0 International License
This work is licensed under a Creative Commons Attribution 4.0 International License.

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